| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption when multiple listeners are being registered with the same file descriptor. |
| Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header. |
| Memory Corruption in WLAN HOST while parsing QMI response message from firmware. |
| Information disclosure when VI calibration state set by ADSP is greater than MAX_FBSP_STATE in the response payload to AFE calibration command. |
| Memory corruption during management frame processing due to mismatch in T2LM info element. |
| Information disclosure when the ADSP payload size received in HLOS in response to Audio Stream Manager matrix session is less than this expected size. |
| Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. |
| Information Disclosure in data Modem while parsing an FMTP line in an SDP message. |
| Memory corruption while copying the result to the transmission queue which is shared between the virtual machine and the host. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption when IPv6 prefix timer object`s lifetime expires which are created while Netmgr daemon gets an IPv6 address. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |
| Memory corruption in Automotive Multimedia due to improper access control in HAB. |